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Are you expecting a solution to help you to achieve the smallest footprint and excellent performance for RF/wireless applications? apmcomm offers hybrid PCB+IPD (Integrated Passive Devices) SiP (System in a Package) technology to make your dreams come true.
apmcomm's commercial-off-the-shelf IPD-SiP design technologies are available to tailor to customers' needs. By integrating bare die stacking, IPD technology, which offers thick copper inductors, a wide range of MIM capacitors, and thin-film resistors, enables the smallest-form-factor SiP products and is most suitable for high-frequency wireless applications. |
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apmcomm's IPD technology is ideal for the production of high-frequency passive devices - such as baluns, couplers, and filters that are used in portable and wireless applications where higher performance equates to longer battery life. Meanwhile, apmcomm has a full-featured design kit for the IPD technology, available for the customers to use. This design kit enables efficient simulation to actual first silicon results. It has the following features: |
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Resistor, capacitor,
and inductor integrated |
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Multilayer interconnection |
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Metallization for bonding
and bumping |
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For further information, please contact apmcomm's sales at 
